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xlamp xm-l leds
Copyright ? 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks Copyright ? 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree?, the Cree logo and XLamp?
are registered
trademarks of Cree, Inc. of Cree, Inc.
99
reflow solderinG
characteristics
In testing, Cree has found XLamp XM-L LeDs to be compatible with JeDeC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profle provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and confgurations of refow soldering equipment.
Profle Feature
lead-based solder
lead-free solder
Average Ramp-Up Rate (Tsmax
to Tp)
3
°C/second max.
3
°C/second max.
Preheat: Temperature Min (Tsmin)
100
°C
150
°C
Preheat: Temperature Max (Tsmax)
150
°C
200
°C
Preheat: Time (tsmin
to ts
max)
60-120 seconds
60-180 seconds
Time Maintained Above: Temperature (TL)
183
°C
217
°C
Time Maintained Above: Time (tL)
60-150 seconds
60-150 seconds
Peak/Classifcation Temperature (Tp)
215
°C
260
°C
Time Within 5
°C of Actual Peak Temperature (tp)
10-30 seconds
20-40 seconds
Ramp-Down Rate
6
°C/second max.
6
°C/second max.
Time 25
°C to Peak Temperature
6 minutes max.
8 minutes max.
Note: All temperatures refer to the topside of the package, measured on the package body surface.
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